Samsung Electronics established the Advanced Packaging (AVP) organization in December to take charge of packaging technology and product development. The South Korean semiconductor giant announced its aim to push the limits of semiconductors with advanced packaging technology.
“Our AVP business team will create products that do not exist in the world now,” Kang Moon-soo, vice president of Samsung Electronics‘ AVP business team leader, said in a March 23 release. State-of-the-art packaging technologies enable more transistors to be integrated into smaller semiconductor packages through heterogeneous integration techniques that connect multiple semiconductors horizontally and vertically. This provides powerful performance beyond each.
“Samsung Electronics is the only company in the world that is in the memory, logic foundry and packaging business,” Kang said. “By leveraging these advantages, we will provide competitive packaging products that connect high-performance memory semiconductors such as state-of-the-art logic semiconductors and high-bandwidth memory (HBM) fabricated through EUV processes through heterogeneous integration.” ”We will communicate directly with customers and commercialize advanced packaging technologies and solutions tailored to their needs and products,” added Kang. “We will focus on developing next-generation 2.5D and 3D advanced packaging solutions based on redistribution layer (RDL), silicon interposer/bridge and through-silicon via (TSV) stacking technologies.” From 2021 to 2027, the advanced packaging market is expected to achieve a high annual growth rate of 9.6%. Among them, the 2.5-dimensional and 3-dimensional packaging market using heterogeneous integration technology is expected to grow at an annual rate of more than 14%, faster than the entire high-tech packaging market.
A package used in the past to simply electrically connect a chip to the outside and protect it. But today, packaging is expanding its role to complement parts that are difficult to implement with chips. In particular, semiconductor manufacturers are developing a new fusion packaging technology to overcome existing technology limitations. Since the release of HBM2 high-bandwidth memory in 2015, Samsung Electronics has successively realized packaging and stacking technology innovations such as I-Cube (2.5D) in 2018 and X-Cube (3D) in 2020.
Samsung Electronics plans to mass-produce the X-Cube (u-Bump) that can handle more data than the normal bump in 2024, and launch the bumpless X-Cube that can handle more data than the X-Cube (u-Bump) in 2026.
Post time: Mar-27-2023