According to semiconductor-digest, the global high-bandwidth memory market is expected to grow from USD 292.7 million in 2022 to USD 3,433.8 million by 2031, at a CAGR of 31.3% during the forecast period 2023-2031.
This growth can be attributed to growing demand for high-performance computing, artificial intelligence, and graphics processing applications that require advanced memory solutions. Compared to traditional DRAM memory solutions, HBM technology offers higher bandwidth, lower power consumption and higher performance, making it the first choice for these applications. High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D stacked Synchronous Dynamic Random Access Memory (SDRAM), originally from Samsung, AMD, and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network equipment, high-performance data center AI ASICs and FPGAs, and some supercomputers such as NEC SX-Aurora TSUBASA and Fujitsu A64FX. The first HBM memory chip was produced by SK Hynix in 2013, and the first device to use HBM was AMD Fiji’s GPU in 2015.
HBM achieves higher bandwidth while using less power in a much smaller form factor than DDR4 or GDDR5. This is accomplished by stacking up to eight DRAM chips and an optional base chip that can include buffer circuits and test logic. The global consumer electronics industry is booming, driven by growing demand for smartphones, tablets, gaming consoles and wearable devices. The high-bandwidth memory market is expected to witness substantial growth as these devices require more advanced memory solutions to support their growing computing requirements. In addition, the emergence of new technologies such as 5G and the Internet of Things (IoT) further drives the demand for HBM, as the need for faster data processing and real-time analysis becomes more important.
Asia Pacific is projected to dominate the global high bandwidth memory (HBM) market, overtaking North America as the leading regional market by 2031. Several factors contribute to this expected dominance, including a booming consumer electronics market, rapid technological advancements, and the presence of key industry players in the region. Another factor contributing to the dominance of Asia Pacific in the global high bandwidth memory market is the presence of leading semiconductor companies such as Samsung, SK Hynix, and TSMC. These South Korea- and Taiwan-based companies are actively investing in the R&D of HBM technology to meet the growing demand for high-performance memory solutions. Moreover, favorable government policies and subsidies in these countries are providing support to the semiconductor industry, contributing to the growth of the high bandwidth memory market. The Asia Pacific region also benefits from a highly skilled workforce and advanced manufacturing facilities. With a strong focus on research and development as well as efficient supply chain management, the region is well-positioned to capitalize on the growing demand for HBM solutions.
Growing Demand For AR And VR Driving High Bandwidth Memory Market Growth
The growing popularity of virtual reality (VR) and augmented reality (AR) systems has been driving the growth of the high bandwidth memory (HBM) market. According to Astute Analytica, the global enterprise VR and AR market was valued at $18.9 billion by 2021 and is expected to reach $364.9 billion by 2030, growing at a CAGR of 39.2% between 2022 and 2030. One of the main reasons for the growing demand for HBM is the need for higher resolution displays for VR and AR systems. These displays require more bandwidth to transfer data between the GPU and memory, which is where HBM comes in. Capable of delivering up to three times the bandwidth of traditional memory solutions, HBM has become ideal for high-resolution displays.
Another factor contributing to the demand for high bandwidth memory market is the complex processing requirements of VR and AR systems. These systems rely on algorithms that need to process large amounts of data in real time, putting pressure on the memory subsystem. HBM’s high bandwidth and low latency make it an ideal solution for handling large amounts of data and complex processing requirements. Energy efficiency is also driving the need for HBM in VR and AR systems. Since these systems are often used in portable devices such as smartphones and tablets, energy efficiency is critical. HBM is designed to consume less power than traditional memory solutions, making it a more energy-efficient choice.
Post time: Mar-27-2023