Samsung Electronics and SK Hynix are engaged in fierce competition in the next-generation high-bandwidth memory (HBM4) market, vying for dominance. HBM4 has become a core infrastructure in the age of artificial intelligence, and this competition is not only a battle between Samsung and SK for global memory leadership, but also concerns the future of the South Korean economy.
The HBM4 market could significantly impact both companies' visions for the future of artificial intelligence, with implications extending beyond next-generation memory technology to the entire supply chain.
Samsung Electronics and SK Hynix's new products
Samsung Electronics and SK Hynix have taken slightly different stances in advancing the logic (foundation) chip process for next-generation high-bandwidth memory (HBM).
Samsung Electronics plans to aggressively adopt ultra-fine processes, prioritizing performance. SK Hynix is also pushing for process miniaturization to meet customer demands, but its strategy focuses primarily on cost-effectiveness. Market attention is focused on how these two companies' strategic technology decisions will shape the future market landscape and their impact.
According to industry sources on the 11th, Samsung Electronics and SK Hynix have adopted different strategies in developing next-generation HBM logic chip processes.
Logic chip
Samsung Electronics is committed to advancing logic chip processes and has begun designing a 2-nanometer process.
The logic chip is responsible for the HBM controller function. It sits beneath the core chip, which vertically stacks multiple DRAMs. The logic chip connects to system semiconductors, such as HBM and GPUs, via the PHY (Physical Layer), enabling high-speed data exchange.
The importance of the logic chip in HBM is increasingly prominent. With the evolution of HBM technology, the performance requirements of the logic chip must also increase due to the improved single-pin processing speed and the increased number of DRAM stacks. Therefore, starting with HBM4, Samsung Electronics and SK Hynix are shifting logic chip production from existing DRAM processes to more advanced foundry processes.
Samsung Electronics is currently the company actively adopting advanced processes in the logic chip field. Previously, Samsung Electronics planned to upgrade its HBM4 logic chip process from 8 nanometers (nm) to 4 nanometers around 2023.
Furthermore, Samsung Electronics is designing logic chips using a 2nm process to prepare for the upcoming era of customized HBM, with HBM4E marking the official start of this era. 2nm is a cutting-edge wafer foundry process that began mass production in the second half of last year. It is understood that the custom SoC team within the System LSI division is currently developing optimized chips for each customer.
An insider emphasized, "HBM customers want lower power consumption and higher bandwidth in their next-generation products, and Samsung Electronics believes the fundamental solution is to advance logic chip manufacturing processes." He added, "We will see concrete results from this research and development this year."
SK Hynix is focusing on cost optimization while preparing for finer processing.
SK Hynix is currently mass-producing its logic chips through TSMC, Taiwan's leading wafer foundry. The HBM4 uses a 12nm process.
SK Hynix also plans to use a 3nm process for its HBM4E chips. While the company initially planned to use a 4nm process, it has reportedly recently upgraded its process to meet customer demands and improve performance.
However, the HBM4E product does not significantly reflect customer needs, and plans are underway to continue using the existing 12nm process for HBM4. Despite recent criticism that HBM4 logic chip performance lags behind its main competitor, Samsung Electronics, Samsung has decided to stick with the existing process.
Industry insiders believe that SK Hynix prioritizes cost optimization over performance enhancement in its logic chip development. In fact, according to internal and external sources, SK Hynix has adopted a relatively conservative approach to advancing its HBM4E logic chip manufacturing process. Instead, its strategy focuses on technological advancements in other areas, such as new packaging methods.
An informed source stated, "SK Hynix believes its current logic chip manufacturing process is sufficient for HBM4E. If it recognizes serious performance issues, it will improve the process." The source added, "Unlike its competitors, SK Hynix believes that rapidly improving logic chip manufacturing processes is not beneficial."
Source: Compiled from zdnet
