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Automotive chip standard system will be released soon, involving MCU, communication, storage and laser radar

Source: Huaqiang Microelectronics  Author: June 

Introduction: Since this year, three standard project drafting groups have been launched for the automotive chip standard work, and the standard system is about to be released. Among them, the third batch includes the standard projects of automobile MCU chip, in vehicle communication chip, storage chip and laser radar chip. Driven by the wave of new energy, domestic automotive chips are booming, and industry standard formulation and certification are gradually improving. 

Just the latest news, Xu Yaozong, director of the China Automotive Strategy and Policy Research (Beijing) Center of the China Automotive Center, said at the 2022 China Automotive Chip Summit Forum today that since this year, three groups of standard project drafting teams have been launched for automotive chip standard work, and the standard system is about to be released. Among them, the third batch includes the standard projects of automobile MCU chip, in vehicle communication chip, storage chip and laser radar chip.

Coincidentally, a few days ago, at the 2022 Auto Chip Technology Innovation and Application Forum, Zou Guangcai, Deputy Secretary General of the China Auto Chip Industry Innovation Strategy Alliance, said that at present, domestic auto chips are still in the early “Spring and Autumn” era, and the number of enterprises is growing rapidly, but most of the auto chip products have only obtained preliminary vehicle specification level certification. It is suggested that enterprises layout and play their own product characteristics and technical advantages, Avoid disorderly competition of low-end products. At the same time, it is expected that the Bank of China standards for automotive chips will be implemented, developed and applied in succession during the 14th Five Year Plan period.

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Generally speaking, vehicle specification level chips require high safety, reliability and stability, and have high technical barriers from design to streaming. In addition, traditional chips, automotive electronics and the whole vehicle have formed a relatively stable cooperation pattern, and short-term replacement is difficult. New energy vehicles provide a new track for domestic car chips. In terms of the number of chips in the whole vehicle, 850 to 1050 chips are required for traditional models and 920 to 1180 chips are required for new energy models. 

In terms of classification, among typical new energy vehicles, power, control, power supply, communication, driver and analog chips are used in large quantities, and the development of intelligent networking also increases the demand for computing, security, wireless communication, storage chips and sensors; On the other hand, with the development of domain controllers, low-end MCU will be integrated into SoC. In addition, some chips with single function may also be integrated into SoC or SBC chips. 

According to the statistics of the Alliance, at present, there are about 110 to 130 enterprises in China that develop and produce automobile chips. Public publicity shows that 50% of enterprises have realized mass production applications, and more than 70% of enterprises have no more than 10 types of supply. In addition, more than 50 chip listed companies claim to have vehicle specification products or mass production applications. 

According to the progress of various types of automobile chips, the gap between power semiconductors and the international market is relatively small, and large-scale replacement is expected in the next three to five years; In comparison, there are many types of driver and analog chips, but there are few domestic products in the market, which can not meet the market demand, and large-scale replacement in this field is difficult; In the field of power supply chips, SBC chips have been developed on a large scale abroad, which is still very lacking compared with low-end vehicle specification product series in China.

On the whole, for a long time, the types and quantities of domestic automotive chips are small, and there is a lack of self formulated specifications. With the large-scale and gradual production of domestic chips, industry standards are urgently needed for guidance and reference. 

In June 2021, the standard working group of China Automotive Chip Industry Innovation Strategy Alliance released the Research Results on the Construction of Automotive Chip Standard System, and completed the Research Results on the Construction of Automotive Chip Standard System in July 2022. According to the requirements of the GX Department, the working group has studied and formulated the Guidelines for the Construction of National Automotive Chip Standard System (Draft), which has been submitted to the GX Department. It is expected that the draft of the guidelines will be open to the industry at an appropriate time for comments, and the national standard for automotive chips is expected to be implemented, developed and applied in succession during the 14th Five Year Plan period. 

At the same time, the Alliance has established a complete set of automobile chip laboratories in Beijing to test the application performance, single chip and controller levels, adaptability and other indicators of the chips, develop four levels of test certification, and improve the framework and implementation rules of vehicle specification level chip certification. In August of this year, the Purple Light Core THA6 control chip won the first vehicle specification level chip product certification in China. 

In addition, for the supply and demand of domestic automotive semiconductors, the Alliance extensively solicited upstream and downstream manufacturers last year, and released the supply and demand docking manual for domestic automotive semiconductors, which included more than 1000 product needs; In addition, the Alliance also pioneered the insurance protection mechanism of automobile chips to cover the risks of automobile chips. At present, auto chip insurance has been adopted by the Implementation Guide for High Precision Industry Development Funds issued by Beijing, and is expected to be promoted nationwide.


Post time: Nov-22-2022